The TS860M5 supports up to 8* next-generation  Intel® Xeon® scalable processors. Its excellent parallel computing power includes a maximum frequency of 3.8 GHz, a Level- 3  cache of 38 39  MB, up to 224*  physical cores, and 448*  threads.

Compared to other servers that utilize the first-generation Intel® Xeon® scalable processor series, the upgraded TS860M5  offers an at least 20% enhancement in computing performance and up to a 20% increase in internal bandwidth. In doing so, it fully meets the requirements of key applications such as large-scale transaction databases, memory databases, virtualized integrationvirtualization and integration , large-scale ERP, and high-performance computing.

The modular I/O design supports full-height and half-height I/O modules, which can be flexibly configured according to user demand in I/O scalability.

The modular hard drive design supports up to 24* 3.5″ hard drives and can be configured to support 12* NVMe hard drives. It also supports configurations of up to 50* 2.5″ hard drives for SAP HANA applications.

The fully modular design allows each module to operate independently and be configured flexibly.

The TS860M5 has over 80*  RAS features supporting a fully modular fault-tolerant design. Therefore, the TS860M5 is extremely suitable for key applications with stringent reliability requirements.

The external PCIe card supports hot-swapping for single cards and supports up to 12* single card hot-swapping operations of external PCIe cards; the PSU supports N+N/N+M redundancy, supports cold and warm redundancy modes, and realizes swapping within microseconds; and the system fans support N+1 redundancy.

The BIOS ROM supports module redundancy and BMC dual mirroring redundancy, can be configured to support global clock redundancy and seamless clock source switching, and has an extremely small probability of failure.

By configuring the system with an OLED display, users can check the server asset information, view and set the management IP address, monitor the power consumption and operating temperature of the chassis, and view the fault information codes.

The processor and memory support offline light path diagnostics to facilitate the identification of malfunctioning components.

The embedded oscilloscope and in-depth hardware diagnosis and analysis functions are able to record and analyze fault signals and rapidly determine the source of error, the software level code-level diagnostics determine the source of code-level faults and black box logging and instant screen capture and video recording of crashes are supported.